Title :
Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection
Author :
Yi Qin ; Changqing Liu ; Wilcox, Geoffrey D. ; Kun Zhao ; Changhai Wang
Author_Institution :
Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough, UK
Abstract :
A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloy, which is one of the promising lead-free solder candidates for electronics interconnection. The bath contained pyrophosphate and iodide as chelating agents. The composition of electrodeposits were measured by wavelength dispersive X-ray spectroscopy (WDS). Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) data indicated that Sn, Ag3Sn and Cu6Sn5 were present in the ¿as-electroplated¿ film. The proposed bath was capable of fine pitch near-eutectic Sn-Ag-Cu solder bumps as demonstrated on a glass test wafer.
Keywords :
electrodeposition; silver alloys; solders; tin alloys; Ag3Sn; Cu6Sn5; Sn; Sn-Ag-Cu; Sn-Ag-Cu solder alloy; X-ray diffraction; chelating agent; electrodeposition; electronics interconnection; iodide based bath; lead-free solder; pyrophosphate based bath; scanning electron microscopy; wavelength dispersive X-ray spectroscopy; Dispersion; Environmentally friendly manufacturing techniques; Lead; Morphology; Scanning electron microscopy; Spectroscopy; Tin; Wavelength measurement; X-ray diffraction; X-ray scattering;
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
DOI :
10.1109/EPTC.2009.5416536
