A Spice-based multi-physics simulation technique for integrated MEMS

Author

Toshiyoshi, Hiroshi

Author_Institution

Res. Center for Adv. Sci. & Technol. (RCAST), Univ. of Tokyo, Tokyo, Japan

fYear

2011

fDate

8-10 Sept. 2011

Firstpage

239

Lastpage

242

Abstract

This paper presents an LSI-designer friendly and handy simulation technique for integrated MEMS (microelectromechanical systems) using a Spice-based circuit simulator. Microelectromechanical components such as electrostatic actuators and elastic springs are interpreted into lumped equivalent circuit models that could be co-solved by an equation-of-motion module with peripheral electrical circuits.

Keywords

SPICE; circuit simulation; electrostatic actuators; equivalent circuits; large scale integration; lumped parameter networks; micromechanical devices; springs (mechanical); LSI-designer; Spice-based circuit simulator; Spice-based multiphysics simulation technique; elastic spring; electrostatic actuator; equation-of-motion module; handy simulation technique; integrated MEMS; lumped equivalent circuit model; microelectromechanical system; peripheral electrical circuit; Actuators; Analytical models; Electrostatics; Force; Integrated circuit modeling; Mathematical model; Micromechanical devices; MEMS; equivalent circuit; microelectromechanical systems; multi-physics simulation;

fLanguage

English

Publisher

ieee

Conference_Titel

Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on

Conference_Location

Osaka

ISSN

1946-1569

Print_ISBN

978-1-61284-419-0

Type

conf

DOI

10.1109/SISPAD.2011.6035069

Filename

6035069