DocumentCode
3521459
Title
2D analytical model for the study of NEM relay device scaling
Author
Shen, Xiaoying ; Chong, Soogine ; Lee, Daesung ; Parsa, Roozbeh ; Howe, Roger T. ; Wong, H. -S Philip
Author_Institution
Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
fYear
2011
fDate
8-10 Sept. 2011
Firstpage
243
Lastpage
246
Abstract
NEM relay is a promising class of device to overcome the power crisis of CMOS circuits. To design these devices and predict their scaling properties, an analytical model highlighting the fundamental physics of the relay operation is highly desired. This work presents a new 2D analytical model for the study of NEM relay scaling. The model retains the physical insights for NEM relays and yet has the simplicity close to the commonly used 1D model. The error as compared to a finite element model is reduced from ~25% (1D model) to ~3% (this work) by introducing a ratio R(a) to account for 2D effects in the 1D formulation. Besides the fundamental mechanical and electrical properties, the model also takes into account surface forces in the operation of NEM relay devices. The impact of surface forces on the operation voltage as devices are scaled down is discussed.
Keywords
CMOS integrated circuits; finite element analysis; nanoelectromechanical devices; relays; 2D analytical model; CMOS circuit; ID model; NEMS relay device scaling; finite element model; fundamental physics; relay operation; surface force; Analytical models; Electrodes; Force; Logic gates; Numerical models; Relays; Structural beams; MEMS; nano-electro-mechanical (NEM) realay; scaling; two-dimensional analytical model;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
Conference_Location
Osaka
ISSN
1946-1569
Print_ISBN
978-1-61284-419-0
Type
conf
DOI
10.1109/SISPAD.2011.6035070
Filename
6035070
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