• DocumentCode
    3521459
  • Title

    2D analytical model for the study of NEM relay device scaling

  • Author

    Shen, Xiaoying ; Chong, Soogine ; Lee, Daesung ; Parsa, Roozbeh ; Howe, Roger T. ; Wong, H. -S Philip

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
  • fYear
    2011
  • fDate
    8-10 Sept. 2011
  • Firstpage
    243
  • Lastpage
    246
  • Abstract
    NEM relay is a promising class of device to overcome the power crisis of CMOS circuits. To design these devices and predict their scaling properties, an analytical model highlighting the fundamental physics of the relay operation is highly desired. This work presents a new 2D analytical model for the study of NEM relay scaling. The model retains the physical insights for NEM relays and yet has the simplicity close to the commonly used 1D model. The error as compared to a finite element model is reduced from ~25% (1D model) to ~3% (this work) by introducing a ratio R(a) to account for 2D effects in the 1D formulation. Besides the fundamental mechanical and electrical properties, the model also takes into account surface forces in the operation of NEM relay devices. The impact of surface forces on the operation voltage as devices are scaled down is discussed.
  • Keywords
    CMOS integrated circuits; finite element analysis; nanoelectromechanical devices; relays; 2D analytical model; CMOS circuit; ID model; NEMS relay device scaling; finite element model; fundamental physics; relay operation; surface force; Analytical models; Electrodes; Force; Logic gates; Numerical models; Relays; Structural beams; MEMS; nano-electro-mechanical (NEM) realay; scaling; two-dimensional analytical model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
  • Conference_Location
    Osaka
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-61284-419-0
  • Type

    conf

  • DOI
    10.1109/SISPAD.2011.6035070
  • Filename
    6035070