DocumentCode :
3521459
Title :
2D analytical model for the study of NEM relay device scaling
Author :
Shen, Xiaoying ; Chong, Soogine ; Lee, Daesung ; Parsa, Roozbeh ; Howe, Roger T. ; Wong, H. -S Philip
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
fYear :
2011
fDate :
8-10 Sept. 2011
Firstpage :
243
Lastpage :
246
Abstract :
NEM relay is a promising class of device to overcome the power crisis of CMOS circuits. To design these devices and predict their scaling properties, an analytical model highlighting the fundamental physics of the relay operation is highly desired. This work presents a new 2D analytical model for the study of NEM relay scaling. The model retains the physical insights for NEM relays and yet has the simplicity close to the commonly used 1D model. The error as compared to a finite element model is reduced from ~25% (1D model) to ~3% (this work) by introducing a ratio R(a) to account for 2D effects in the 1D formulation. Besides the fundamental mechanical and electrical properties, the model also takes into account surface forces in the operation of NEM relay devices. The impact of surface forces on the operation voltage as devices are scaled down is discussed.
Keywords :
CMOS integrated circuits; finite element analysis; nanoelectromechanical devices; relays; 2D analytical model; CMOS circuit; ID model; NEMS relay device scaling; finite element model; fundamental physics; relay operation; surface force; Analytical models; Electrodes; Force; Logic gates; Numerical models; Relays; Structural beams; MEMS; nano-electro-mechanical (NEM) realay; scaling; two-dimensional analytical model;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
Conference_Location :
Osaka
ISSN :
1946-1569
Print_ISBN :
978-1-61284-419-0
Type :
conf
DOI :
10.1109/SISPAD.2011.6035070
Filename :
6035070
Link To Document :
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