Title :
A novel micro pirani gauge with mono-wire sensing unit for microsystem application
Author :
Qiu, Yunsong ; Zhao, Lei ; Jin, Yufeng
Author_Institution :
Shenzhen Grad. Sch., Peking Univ., Shenzhen, China
Abstract :
This paper reports a novel, simple, low-cost and high sensitivity micro Pirani gauge to monitor long-time pressure change and stability inside a vacuum package. The packaging structure is very simple with one wire as sensing part only. Two ends of a metal wire with a certain temperature coefficient of resistance are bonded to the pads of the ceramic structure with a cavity for microsystem application. The metal wire and the packaged part can be formed as a micro Pirani gauge. The dynamic range of this novel Pirani gauge in our experiment is from 1Pa to 100Pa.
Keywords :
micromechanical devices; pressure gauges; pressure measurement; stability; ceramic structure; microPirani gauge; microsystem; mono-wire sensing unit; pressure 1 Pa to 100 Pa; pressure change monitoring; stability; temperature coefficient; vacuum package; Biomembranes; Bonding; Dynamic range; Electronic packaging thermal management; Micromachining; Solids; Temperature sensors; Testing; Thermal conductivity; Wire;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270710
