DocumentCode :
3521601
Title :
Dynamic visualizations of flow and meniscus for quadrilateral bump arrangement in capillary underfill process
Author :
Lee, Seok Hwan ; Sung, Jaeyong
Author_Institution :
Grad. Sch. of Nano Inf. Design Fusion Technol., Seoul Nat. Univ. of Technol., Seoul, South Korea
fYear :
2009
fDate :
9-11 Dec. 2009
Firstpage :
215
Lastpage :
219
Abstract :
This study has investigated the dynamic variations of flow and meniscus during underfill process using flow visualization technique to understand physics of underfill flows. As a quantitative flow visualization technique, ¿-PIV(micro particle image velocimetry) was applied. Glycerin was filled into a glass chip which has quadrilateral bump arrangement. It was found that the wetting distance increases rapidly when the meniscus attaches onto the bump and it increases slowly when the meniscus detaches from the bump. The contact angle and the meniscus velocity are in-phase according to the meniscus position. The flow velocity is the fastest between bumps when the meniscus is detached and then the flow velocity continuously gets slow down.
Keywords :
contact angle; flip-chip devices; flow visualisation; wetting; capillary underfill process; contact angle; dynamic flow visualizations; dynamic variations; flip chip technology; flow velocity; glass chip; glycerin; meniscus position; meniscus velocity; microparticle image velocimetry; quadrilateral bump arrangement; quantitative flow visualization technique; underfill flows; wetting distance; ¿-PIV; Filling; Flip chip; Fluorescence; Glass; Mechanical engineering; Microscopy; Particle measurements; Semiconductor device measurement; Velocity measurement; Visualization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
Type :
conf
DOI :
10.1109/EPTC.2009.5416549
Filename :
5416549
Link To Document :
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