• DocumentCode
    3521647
  • Title

    First-principles based modeling for influence of epitaxy and packaging induced strains on emission properties of III-nitrides LED chips

  • Author

    Yan, Han ; Gan, Zhiyin ; Song, Xiaohui ; Chen, Zhaohui ; Xu, Jingping ; Liu, Sheng

  • Author_Institution
    Dept. of Electron. of Sci. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    429
  • Lastpage
    432
  • Abstract
    Undesired residual strain always exists in the epitaxial film inevitably as a result of lattice mismatch and thermal expansion mismatch between the substrate and the epitaxial film. The strain affects crystalline quality as well as optical and electrical properties of LED epitaxial film. In this paper, we report on the effects of strain on the emission properties of III-nitrides based LEDs grown on various substrates. As results, the band-gap energy of III-nitrides shows blue shift with increasing compressive strain and increases in tensile strain results in a decrease of band-gap energy. A linear relation of the band-gap of III-nitride with the biaxial strain is observed. In addition, III-nitrides materials with larger band-gap energy show a larger shift of emission energy, which means purple and ultraviolet LEDs will be more non-uniform than blue and red LEDs under the same strain states.
  • Keywords
    III-V semiconductors; ab initio calculations; energy gap; epitaxial layers; light emitting diodes; semiconductor device packaging; wide band gap semiconductors; III-nitrides; III-nitrides LED chips; LED epitaxial film; LEDs growth; band-gap energy; compressive strain; crystalline quality; first-principles based modeling; packaging; purple LEDs; residual strain; strain affects; tensile strain; ultraviolet LEDs; Capacitive sensors; Epitaxial growth; Lattices; Light emitting diodes; Optical films; Packaging; Photonic band gap; Semiconductor process modeling; Substrates; Tensile strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270718
  • Filename
    5270718