Title :
A novel simulation methodology for development of ESD primitives on a 0.18µm analog, mixed-signal high voltage process technology
Author :
Roger, Frederic ; Cambieri, Juri ; Minixhofer, Rainer
Author_Institution :
Austriamicrosystem, Schloss Premstatten, Austria
Abstract :
This paper presents a full simulation methodology dedicated to the ESD primitive devices development in High Voltage technology. This workflow based on layout generation, 2D, 3D and mixed-mode TCAD simulations and SPICE simulations provide robust devices sustaining ESD stress tests.
Keywords :
SPICE; circuit simulation; electrostatic discharge; integrated circuit layout; mixed analogue-digital integrated circuits; power integrated circuits; technology CAD (electronics); 2D TCAD simulation; 3D TCAD simulation; ESD primitive device; ESD stress tests; SPICE simulation; analog high voltage process technology; electrostatic discharge; full simulation methodology; layout generation; mixed-mode TCAD simulation; mixed-signal high voltage process technology; size 0.18 mum; Electrostatic discharge; Integrated circuit modeling; Layout; Robustness; SPICE; Semiconductor process modeling; Solid modeling; 0.18µm High voltage technology; 2D and 3D TCAD simulation; ESD; Mixed-mode simulations; SPICE;
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2011 International Conference on
Conference_Location :
Osaka
Print_ISBN :
978-1-61284-419-0
DOI :
10.1109/SISPAD.2011.6035080
