Coupled simulation of anisotropic conductive adhesive bonding process and reliability analysis of the packaging

Anisotropic conductive adhesive (ACA) flip chip interconnection offer many distinct advantages over the traditional solder flip chip interconnection. But the reliability of the ACA is still a concerned issue. There are many studies on this topic, and most of them studies only one physics field was include in analysis each time. In fact, ACA bonding is a complicated process involving multiple physics and they usually occurred simultaneously and coupled with each other. In this study a numerical method is developed to solve coupled physics fields problems. The effects of all fields are taken into consideration by solving the equation of each physics field simultaneously. A parametric nonlinear finite element model was built for an ACA bonding process considering the effects of temperature and pressure. The deformation of particles and the stress development in packaging was investigated. Finally the optimal values were obtained from the results of analysis. The numerical simulation results match the experiments basically. The approach developed in the paper can be used to provide guideline for electronic packaging design and process parameter selection when using ACA as interconnection material.