• DocumentCode
    3521859
  • Title

    Analysis and modeling of liquid cooled heat sinks with alternating honeycomb structure

  • Author

    Zhang, H.Y. ; Mui, Y.C. ; Tarin, Michael

  • Author_Institution
    Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
  • fYear
    2009
  • fDate
    9-11 Dec. 2009
  • Firstpage
    146
  • Lastpage
    152
  • Abstract
    In this paper, the analysis and modeling of a new type of liquid cooled heat sink are conducted. The heat sink is represented by alternating metallic foil layers with nearly honeycomb-shaped porous structure. The major advantage of this type of heat sink lies in the ease of fabrication with controllable geometrical parameters. The solid volume fractions and effective thermal conductivity in heat flow direction are analyzed with strut geometry and cylinder size. In order to examine the thermal performance with electronic packages, the simulation model is constructed with an off-the-shelf honeycomb heat sink (HCHS) with footprint size of 42 mm × 42 mm. The flow fields, pressure and temperature profiles are obtained based on the present model. Parametric effects including the flow rates, the solid struts, and base plate bonding materials on thermal performance are examined. Experimental study was also conducted to verify simulation modeling.
  • Keywords
    electronics packaging; foils; heat conduction; heat sinks; honeycomb structures; porous materials; thermal conductivity; alternating honeycomb structure; alternating metallic foil layers; base plate bonding materials; cylinder size; effective thermal conductivity; electronic packages; flow fields; flow rates; footprint size; heat flow direction; honeycomb-shaped porous structure; liquid cooled heat sinks; off-the-shelf honeycomb heat sink; pressure profile; simulation model; solid volume fractions; strut geometry; temperature profile; Bonding; Conducting materials; Electronic packaging thermal management; Fabrication; Geometry; Heat sinks; Honeycomb structures; Solids; Temperature control; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-5099-2
  • Electronic_ISBN
    978-1-4244-5100-5
  • Type

    conf

  • DOI
    10.1109/EPTC.2009.5416561
  • Filename
    5416561