DocumentCode :
3521932
Title :
Designing a high speed system with amplitude and phase noise reduction effects
Author :
Song, Ki-Jae ; Kim, Jongmin ; Woo, Ki-Ryong ; Park, Ilwon ; Nah, Wansoo ; Song, Young-Hee
Author_Institution :
Test & Package Dev. Center, Samsung Electron., Seoul, Taiwan
fYear :
2009
fDate :
9-11 Dec. 2009
Firstpage :
102
Lastpage :
106
Abstract :
In this paper, we introduce a method for reducing the amplitude and the phase noise to achieve low noise and high speed system. Obtaining a good signal and maintaining the power integrity, by eliminating noise development and propagation are constant requirements. However, the increase of the interconnection complexity in the multilayer PCBs (printed circuit boards) usually creates a questionable noise source that can be caused by either the signal mismatch or the power disturbance. Especially, the SSN (simultaneous switching noise) and coupled noise need to be deliberately examined for reducing the overall noises. After the noise generation and propagation are analyzed, the amplitude and phase noise on the high speed signal will be investigated by using the integrated simulation circuit model (ISCM) technique and according to some related experiments. In this paper, we also propose a multi-PDN structure (M-PS) for minimizing the noise generation and propagation within the wanted frequency band. This method uses an additional core PDN to control the values of the R, L, and C parameters on the equivalent circuit of the system´s PDN.
Keywords :
equivalent circuits; integrated circuit modelling; integrated circuit noise; multilayers; phase noise; printed circuits; equivalent circuit; high speed system; integrated simulation circuit model; interconnection complexity; multiPDN structure; multilayer PCB; phase noise reduction effects; power integrity; printed circuit boards; simultaneous switching noise; Circuit noise; Coupling circuits; Integrated circuit interconnections; Noise generators; Noise level; Noise reduction; Nonhomogeneous media; Phase noise; Power system interconnection; Printed circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5099-2
Electronic_ISBN :
978-1-4244-5100-5
Type :
conf
DOI :
10.1109/EPTC.2009.5416567
Filename :
5416567
Link To Document :
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