Title :
Effects of shape parameters on tensile strength of Cu bump
Author :
Huang, Chunyue ; Liang, Ying ; Li, Tianming
Author_Institution :
Sch. of Electro-Mech. Eng., Guilin Univ. of Electron. Technol., Guilin, China
Abstract :
Three parameters, copper pad material, pad thickness, and bump patterns were chosen as three control factors. By using an L9(34)orthogonal array the copper stud bump solder joints which have 9 different combinations of parameters were designed. The finite element analysis models of 9 copper stud bump solder joints were established by using ANSYS/LS-DYNA, and analyzed the finite element tensile simulation. Tensile strain data of copper stud bump solder joint were obtained under 9 different parameters combinations; it was analyzed through range analysis and variance analysis. The result shows that of the three parameters, the descending order of affecting the copper stud bump solder joint tensile strain is copper pad material, bump patterns, and pad thickness. With 95% confidence, copper pad material has a significant effect on the copper stud bump solder joint tensile strain whereas bump patterns and pad thickness has little.
Keywords :
chip scale packaging; copper; finite element analysis; flip-chip devices; solders; tensile strength; ANSYS-LS-DYNA; Cu; L9(34)orthogonal array; bump patterns; copper stud bump solder joints; finite element analysis models; flip-chip technology; integrated circuit packaging; pad thickness; range analysis; shape parameters; tensile simulation; tensile strain; tensile strength; variance analysis; Analysis of variance; Bonding; Copper; Costs; Educational institutions; Finite element methods; Materials science and technology; Shape control; Soldering; Tensile strain;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270734
