Title :
Research of methodologies to enlarge the isolation in 3D interconnection
Author :
Zhao, Liwei ; Yang, Long ; Sun, Xin ; Jin, Yufeng
Author_Institution :
Nat. Key Lab. of Micro/Nano Fabrication Technol., Peking Univ., Beijing, China
Abstract :
As the speed of digital systems continues to increase, digital design has entered a new realm that requires high integration and high complexity with limited dimension. Different from the parameter analysis in low frequency which mainly focuses on resistances and their effects, the coactions of resistances, inductances and capacitances are all needed to be taken into account in high frequency. This paper uses finite element method (FEM) to analyze the coupling and isolation of three types of structures, and presents a measure for the purpose of improving the performance of TSV.
Keywords :
integrated circuit design; integrated circuit interconnections; isolation technology; printed circuit design; 3D interconnection; digital design; finite element method; isolation technology; through silicon vias; Capacitance; Digital systems; Electrical resistance measurement; Finite element methods; Frequency; Performance analysis; Through-silicon vias;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270737
