Title :
Simulation of fluid flow and heat transfer in microchannel cooling for LTCC electronic packages
Author :
Zhang, J. ; Zhang, Y.F. ; Miao, M. ; Jin, Y.F. ; Bai, S.L. ; Chen, J.Q.
Abstract :
The hydrodynamic and thermal characteristics of microchannel networks are investigated by finite element analysis with commercial software Fluent. The simulation model is based on fabricated thick film LTCC substrate with 3D cooling microchannels. A comparison of the cooling performance among fractal-shaped microchannel, parallel microchannel, serpentine microchannel, spiral microchannel is also conducted numerically based on the same heat flux and the same mass flow rate. It is found that fractal-shaped microchannel facilitates the lowest fluid pressure drop and the most uniform temperature distribution over the substrate, and that the spiral microchannel network enables the smallest temperature rise.
Keywords :
ceramic packaging; cooling; finite element analysis; flow simulation; heat transfer; hydrodynamics; microchannel flow; temperature distribution; 3D cooling microchannels; LTCC electronic packages; commercial software Fluent; fabricated thick film LTCC substrate; finite element analysis; fluid flow simulation; fluid pressure drop; fractal-shaped microchannel; heat flux; heat transfer; hydrodynamic characteristics; mass flow rate; parallel microchannel; serpentine microchannel; spiral microchannel; temperature distribution; thermal characteristics; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Fluid flow; Fractals; Heat transfer; Microchannel; Spirals; Substrates; Temperature distribution;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270740
