Title :
Modeling of heat transfer performance for an array of micro jets impinging upon dimpled surface
Author :
Geng, Tian-Yi ; Fan, Jing-Yu ; Zhang, Yan ; Wang, Shun
Author_Institution :
Shanghai Inst. of Appl. Math. & Mech., Shanghai Univ., Shanghai, China
Abstract :
The present paper paid particular attention to the flow and heat transfer performance for an array of micro jets impinging upon the dimpled surface by means of CFD modeling. The modeling of a three-by-four jet array impinging upon the smooth, concave- and convex-dimpled surfaces was carried out based on the solution of the steady, incompressible and three-dimensional RANS and energy equations by employing the RNG k-epsiv turbulence model. It has been demonstrated from the present study that the heat transfer performance for an array of the micro jets impinging onto the concave- or convex-dimpled surfaces tends to be somewhat attenuated or augmented in the impingement region, respectively, as compared with that onto the smooth one. And the variational trend with respect to the Nusselt number distribution in the inter-jet region appears to be inconsistent with that in the impingement region. In addition, the flow pattern and primary mechanism by which the smooth, concave- and convex-dimpled surfaces significantly affect the flow field and heat transfer are analyzed and discussed.
Keywords :
computational fluid dynamics; heat transfer; jets; thermal management (packaging); CFD modeling; Nusselt number distribution; RNG k-epsiv turbulence model; concave surfaces; convex dimpled surface; heat transfer performance; micro jet array; smooth surface; Electronics cooling; Geometry; Heat sinks; Heat transfer; Microchannel; Microstructure; Rough surfaces; Surface roughness; Temperature; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270743