DocumentCode :
3522200
Title :
A thermal model for calculating thermal resistance of eccentric heat source on rectangular plate with convective cooling existing at upper and lower surfaces
Author :
Luo, Xiaobing ; Mao, Zhangming ; Liu, Sheng
fYear :
2009
fDate :
10-13 Aug. 2009
Firstpage :
294
Lastpage :
298
Abstract :
Heat sources on rectangular plate with cooling at both upper and lower surfaces are common in electronic devices. A thermal model for calculating thermal resistance of eccentric heat source on plate with convective cooling at upper and lower surface is presented in this paper. The model was applied for calculating thermal resistance of a plate at three groups of boundary conditions. Simulations for calculating thermal resistance at the same boundary conditions were also done by software COMSOL. The comparison between the thermal resistances calculated by the presented model and the ones obtained by simulations showed that the proposed model is suitable for thermal resistance calculation of rectangular plate with cooling at both surfaces. The presented model can calculate the plate thermal resistance at following boundary conditions with high accuracy : I) Free convection at both surfaces; II) Free convection at upper surface and forced convection at lower surface.
Keywords :
convection; cooling; thermal resistance; convective cooling; eccentric heat source; rectangular plate; thermal model; thermal resistance; Boundary conditions; Eigenvalues and eigenfunctions; Electronic packaging thermal management; Electronics cooling; Heat transfer; Resistance heating; Surface resistance; Surface treatment; Temperature; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
Type :
conf
DOI :
10.1109/ICEPT.2009.5270746
Filename :
5270746
Link To Document :
بازگشت