Title :
Modeling thermal fatigue in anisotropic Sn-Ag-Cu/Cu solder joints
Author :
Yang, Shihua ; Tian, Yanhong ; Wang, Chunqing ; Huang, Tengfei
Author_Institution :
Dept. of Electron. Packaging Technol., Harbin Inst. of Technol., Harbin, China
Abstract :
Properties of body-centered tetragonal beta-Sn are highly anisotropic. The crystal orientation of the beta-Sn has a marked effect on the stress state in the SnAgCu solder joints. A finite element analysis has been performed of the thermal cycling of the SnAgCu solder and solder joints. Significant amounts of stresses at the solder/Cu interface and in the plane of the grain boundary was found. The best Sn grain orientation is perpendicular to the solder/Cu interface.
Keywords :
copper alloys; crystal orientation; finite element analysis; grain boundaries; silver alloys; soldering; solders; thermal analysis; thermal stress cracking; tin alloys; Sn-Ag-Cu; anisotropic solder joints; crystal orientation; finite element analysis; grain boundary; grain orientation; thermal cycling; thermal fatigue modeling; Anisotropic magnetoresistance; Copper alloys; Fatigue; Finite element methods; Grain boundaries; Lead; Soldering; Temperature distribution; Thermal stresses; Tin;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270748
