Title :
Fracture simulation of solder joint interface by Cohesive Zone Model
Author :
An, Tong ; Qin, Fei
Author_Institution :
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China
Abstract :
In this paper, the damage fracture of solder joints in board level electronic package subjected to drop impact loadings was numerically simulated by the finite element method and the cohesive zone model. The solder-Cu pad interface was modeled by cohesive zone elements. The results show that fracture initiates at the edge of the PCB side and the damage of solder joint is affected greatly by the used material constitutive model in the simulation.
Keywords :
copper; electronics packaging; failure analysis; finite element analysis; fracture; impact (mechanical); printed circuits; solders; PCB; board level electronic package; cohesive zone elements; cohesive zone model; drop impact loadings; finite element method; material constitutive model; numerical simulation; printed circuit board; solder joint damage fracture simulation; solder joint interface; solder-copper pad interface; Electronics packaging; Environmentally friendly manufacturing techniques; Failure analysis; Fatigue; Finite element methods; Joining materials; Lead; Numerical simulation; Plastics; Soldering;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270751
