DocumentCode :
3522393
Title :
Molecular dynamics of nanofluids with time-dependent thermal conductivity in heat sink dissipation
Author :
Wang, Xiaojing ; Liu, Hongjun ; Zhang, Wen ; Li, Zongshuo ; Chen, Ling
Author_Institution :
Shanghai Univ. Shanghai Univ., Shanghai, China
fYear :
2009
fDate :
10-13 Aug. 2009
Firstpage :
230
Lastpage :
233
Abstract :
Since the pioneering work by Tuckerman & Pease, lots of publications about heat sink have been researched in the last decade. Many enhancements are suggested in order to increase the critical heat current of heat sink including nanofluids which are solid-liquid mixtures composed of nanoparticles and basic liquid. The values of the thermal properties of nanofluids are enhanced to a large degree, even when the concentration of the nanoparticles is non-ignorably small. Molecular dynamics (MD) method can be used to generate and accurately trace the trajectories of the simulated particles and the interaction of the nanoparticles with the base fluid. In this study, MD is used to simulate the thermal conductivity of nanofluids obtained from the non-equilibrium MD (NEMD) approach under different temperatures. And simulations are based on the commercial software package FLUENT and treating the nanofluids as a two-phase mixture. Thermal resistance of four different coolants with different inlet velocities and heating powers are computed. Results show temperature-dependent thermal conductivity can´t be neglected while simulating especially when the inlet velocity is large and the heating power is low.
Keywords :
heat sinks; microchannel flow; molecular dynamics method; nanofluidics; nanoparticles; thermal conductivity; thermal resistance; FLUENT software package; critical heat current; heat sink dissipation; heating power; inlet velocity; microchannel flow; nanofluids; nanoparticles; nonequilibrium molecular dynamics method; solid-liquid mixtures; thermal resistance; time-dependent thermal conductivity; two-phase mixture; Computational modeling; Coolants; Fluid dynamics; Heat sinks; Nanoparticles; Resistance heating; Software packages; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
Type :
conf
DOI :
10.1109/ICEPT.2009.5270757
Filename :
5270757
Link To Document :
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