Multiscale delamination modeling of an anisotropic conductive adhesive interconnect based on micropolar theory and cohesive zone model

With the trend towards high performance, portability and low cost for electronic products, the packaging density in microsystem has become higher and the components have tended to be minimal. Flip-chip technology is superior because of its high packaging density and speed signal processing. There is an increasing interest in using electrically conductive adhesives as the interconnection material in flip-chip assembly due to its fine pitch I/Os, fewer number of processing steps, lower process temperature and environmental-friendliness. The interconnect behavior is a key issue in the long-term reliability of the system performance. In the present paper, a multiscale interface model was developed on the basis of micropolar theory, in which a cohesive zone model was also introduced to describe the possible delamination process that might occur when the interconnection was subjected to the thermal cycling loading. The delamination model was implemented using finite element method, and the numerical analysis for the reliability of an anisotropic conductive adhesive interconnect was made as the model application.