DocumentCode
3523242
Title
Artificial neural network application in vertical interconnection modeling
Author
Liang, Yuanjun ; Li, Lei
fYear
2009
fDate
10-13 Aug. 2009
Firstpage
56
Lastpage
59
Abstract
This paper proposes a neural network-based method for modeling vertical interconnect balls. The pi equivalent circuit with lumped element was used to characterize the electrical performance of balls. The values of lumped elements were extracted from the full-wave simulate result, and the extracted data was used to train back-propagation (BP) neural networks to obtain the relationship between the lumped element values and the physical size of the balls. Then this model was used to estimate the electrical character of ball with other layout parameters.
Keywords
backpropagation; electronic engineering computing; equivalent circuits; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; neural nets; artificial neural network; backpropagation neural network; equivalent circuit; full wave simulation; lumped element value; vertical interconnect ball; vertical interconnection modeling; Artificial neural networks; Circuit simulation; Dielectric losses; Electromagnetic modeling; Electronics packaging; Equivalent circuits; Frequency; Integrated circuit interconnections; Neural networks; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4658-2
Electronic_ISBN
978-1-4244-4659-9
Type
conf
DOI
10.1109/ICEPT.2009.5270796
Filename
5270796
Link To Document