Title :
Artificial neural network application in vertical interconnection modeling
Author :
Liang, Yuanjun ; Li, Lei
Abstract :
This paper proposes a neural network-based method for modeling vertical interconnect balls. The pi equivalent circuit with lumped element was used to characterize the electrical performance of balls. The values of lumped elements were extracted from the full-wave simulate result, and the extracted data was used to train back-propagation (BP) neural networks to obtain the relationship between the lumped element values and the physical size of the balls. Then this model was used to estimate the electrical character of ball with other layout parameters.
Keywords :
backpropagation; electronic engineering computing; equivalent circuits; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; neural nets; artificial neural network; backpropagation neural network; equivalent circuit; full wave simulation; lumped element value; vertical interconnect ball; vertical interconnection modeling; Artificial neural networks; Circuit simulation; Dielectric losses; Electromagnetic modeling; Electronics packaging; Equivalent circuits; Frequency; Integrated circuit interconnections; Neural networks; Polymers;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270796
