Title :
Packaging and assembly of 12-channel parallel optical transceiver module
Author :
Li, Zhihua ; Gao, Wei ; Song, Jian ; Li, Baoxia ; Wan, Lixi
Author_Institution :
Inst. of Microelectron., Chinese Acad. of Sci., Beijing, China
Abstract :
The fabrication process of a 12-channel parallel optical transceiver module developed in our group is presented in this paper. The module is composed of a VCSEL array, a PIN PD array, a VCSEL driver chip, a TIA/LA chip and supporting PCB and connector. A SiOB and its vertical assembly are emphasized as the highlights of the structure of this module, which is promising to effectively reduce the package cost and improve the optical coupling efficiency.
Keywords :
optical fabrication; optical interconnections; p-i-n photodiodes; semiconductor device packaging; semiconductor laser arrays; surface emitting lasers; 12-channel parallel optical transceiver module; PCB; PIN PD array; TIA-LA chip; VCSEL array; VCSEL driver chip; connector; device packaging; fabrication process; optical coupling efficiency; optical interconnencts; vertical silicon optical bench assembly; Assembly; Connectors; Costs; High speed optical techniques; Optical arrays; Optical device fabrication; Optical interconnections; Packaging; Transceivers; Vertical cavity surface emitting lasers;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270802
