• DocumentCode
    3523512
  • Title

    Neural networks for microwave characterization of material samples in rectangular cavities

  • Author

    Penirshke, A. ; Freese, Jens ; Schubler, M. ; Jakoby, Rorf

  • Author_Institution
    Institut fur Hochfrequentechnik, Technische Univ. Darmstadt, Germany
  • fYear
    2003
  • fDate
    14-17 Dec. 2003
  • Firstpage
    609
  • Lastpage
    611
  • Abstract
    In order to characterize material samples of different sizes at microwaves, use was made of a rectangular metallic cavity, which is partially filled by these material samples, having arbitrary locations. Subsequently, by using a multi-layer perceptron (MLP) network, its dielectric constant, dielectric losses and its amount could be accurately extracted from measurements of the magnitude of the scattering parameter |S11| only, since the phase information was not available. The input for this network is generated by a proper preprocessing of the simulated and measured magnitude of the return loss |S11|. The investigations indicate very good agreement of the simulated and measured data, thus, a simulation-based training of neural networks and an subsequent parameter extraction of the material samples from |S11|-measurements was possible with high accuracy.
  • Keywords
    S-parameters; dielectric losses; dielectric materials; electrical engineering computing; microwave materials; microwave measurement; multilayer perceptrons; permittivity; dielectric constant; dielectric losses; material samples; microwave characterization; multilayer perceptron network; neural networks; rectangular cavities; subsequent parameter extraction; Data mining; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric materials; Dielectric measurements; Inorganic materials; Loss measurement; Multilayer perceptrons; Neural networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Processing and Information Technology, 2003. ISSPIT 2003. Proceedings of the 3rd IEEE International Symposium on
  • Print_ISBN
    0-7803-8292-7
  • Type

    conf

  • DOI
    10.1109/ISSPIT.2003.1341194
  • Filename
    1341194