• DocumentCode
    3523668
  • Title

    Dielectric Properties of Boron Nitride Filled Epoxy Composites

  • Author

    Zhang, Chao ; Stevens, Gary C.

  • Author_Institution
    Polymer Res. Centre, Surrey Univ., Guildford
  • fYear
    2006
  • fDate
    15-18 Oct. 2006
  • Firstpage
    19
  • Lastpage
    22
  • Abstract
    In this paper, we report some preliminary measurements on the dielectric response and properties of boron nitride filled epoxy resin composites consisting of a typical anhydride cured bisphenol-A epoxy resin system. Both conventional stirring and ultrasonic processing had been used to obtain fine dispersion of the microfillers in the matrix. Dielectric spectroscopy of the samples has been undertaken in the frequency domain from 10-2 Hz to 106 Hz and in the temperature range from -50 to 120 degC. The results showed that the dielectric constant of the composites increase slightly with increasing concentration of fillers. A broad loss peak is present in the low frequency region in all samples from pure epoxy resin to composites with 20 wt% of boron nitride. This peak moves to higher frequencies with increasing temperature, and no obvious difference in position and shape of this peak is found across all levels of filling at each temperature. The dc conduction current has also been measured in the temperature range from -50 to 120 degC. The results showed that there is no significant difference in the dc conduction current across this temperature range and there is only a weak dependence on the concentration of the fillers above 60 degC.
  • Keywords
    boron compounds; dielectric losses; electric breakdown; filled polymers; glass transition; permittivity; resins; ultrasonic machining; -50 to 120 C; 10E-2 to 10E6 Hz; BN; anhydride cured bisphenol-A epoxy resin; boron nitride filled epoxy composite; dc conduction current; dielectric constant; dielectric properties; dielectric spectroscopy; filler concentration; glass transition temperature; microfillers dispersion; stirring; ultrasonic processing; Boron; Dielectric constant; Dielectric measurements; Electrochemical impedance spectroscopy; Epoxy resins; Frequency domain analysis; Shape; Temperature distribution; Temperature measurement; Ultrasonic variables measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2006 IEEE Conference on
  • Conference_Location
    Kansas City, MO
  • Print_ISBN
    1-4244-0547-5
  • Electronic_ISBN
    1-4244-0547-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2006.312052
  • Filename
    4105360