Title :
A wireless pressure sensor based on surface transverse wave
Author :
Kang, A-long ; Wang, Wei-biao ; Liu, You-Qun ; Han, Tao
Author_Institution :
Shanghai Jiaotong Univ., Shanghai, China
Abstract :
The surface acoustic wave (SAW) pressure sensor is usually composed of a clamped circular quartz membrane, where a one-port Rayleigh wave mode resonator is fabricated. In order to improve the reliability and the accuracy of the wireless pressure sensor, a wireless pressure sensor based on surface transverse wave (STW) is studied. Combined with the perturbation theory proposed by Tiersten and the Green´s function simulator, the pressure-induced frequency shifts for STW on quartz are calculated. The calculated results demonstrate that the cut orientation in vicinity of BT cut membrane has simultaneously both high pressure sensitivity and delay temperature stability of STW. The pressure sensitivity is over three times that of the ST-cut quartz for SAW. In order to further improve the sensitivity of the sensor, a novel cantilever package is proposed. The geometry of the sensor is determined by using FEM software. The experimental data show that the pressure sensitivity is sufficiently high and the relative frequency shift varies linearly.
Keywords :
Green´s function methods; cantilevers; finite element analysis; pressure sensors; quartz; resonators; surface acoustic wave sensors; FEM software; Green function simulator; Rayleigh wave mode resonator; SAW; ST-cut quartz; STW; cantilever package; clamped circular quartz membrane; delay temperature stability; high pressure sensitivity; perturbation theory; pressure-induced frequency shifts; sensor geometry; surface acoustic wave pressure sensor; surface transverse wave; wireless pressure sensor; Finite element methods; Resonant frequency; Sensitivity; Stress; Surface acoustic waves; Wireless communication; Wireless sensor networks; pressure sensor; surface transverse wave; wireless;
Conference_Titel :
Piezoelectricity, Acoustic Waves and Device Applications (SPAWDA), 2011 Symposium on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-1075-8
DOI :
10.1109/SPAWDA.2011.6167233