DocumentCode :
3524105
Title :
Love waves in piezoelestric layered structure with functionally graded materail half space
Author :
Cao, Xiao-Shan ; Jin, Feng ; Mo, Xiao-Yi ; Shi, Jun-Ping
Author_Institution :
Dept. of Eng. Mech., Xi´´an Univ. of Technol., Xi´´an, China
fYear :
2011
fDate :
9-11 Dec. 2011
Firstpage :
240
Lastpage :
244
Abstract :
In this theoretical study, we investigate the propagation of Love waves in a piezoelectric layered structure. The substrate of the layered structure is a functionally graded material (FGM) in which parameters vary along thickness and in the bounded domain. Both variable substitution and power series technique, which are shown to have good convergence and high precision, are employed for the asymptotic analytical derivations of the governing equation of Love wave. The influence of the gradient coefficient of FGM on the dispersion curves, and electro-mechanical coupling factor, and the displacement amplitude distributions of Love waves in this structure are investigated. The theoretical results set guidelines not only for the design of high performance surface acoustic waves (SAW) devices using the FGM substrate, but also for the measurement of material properties of FGM half space using Love waves.
Keywords :
Love waves; functionally graded materials; gradient methods; piezoelectricity; surface acoustic wave devices; Love waves; asymptotic analytical derivations; bounded domain; convergence; dispersion curves; displacement amplitude distribution; electromechanical coupling factor; functionally graded material half space; gradient coefficient; high performance surface acoustic waves device; piezoelectric layered structure; power series technique; Couplings; Dispersion; Electric potential; Equations; Substrates; Surface acoustic waves; Electro-mechanical coupling factor; Functionally graded material (FGM); Love waves; Piezoelectric layered structure; Surface acoustic wave (SAW) devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Piezoelectricity, Acoustic Waves and Device Applications (SPAWDA), 2011 Symposium on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-1075-8
Type :
conf
DOI :
10.1109/SPAWDA.2011.6167235
Filename :
6167235
Link To Document :
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