Title :
Research on the excitation modes of PZT element in bending cylindrical transducers
Author :
Cheng, Ting-hai ; Guo, Xiang-dong ; Bao, Gang
Author_Institution :
Sch. of Mechatron. Eng., Harbin Inst. of Technol., Harbin, China
Abstract :
The PZT element acts as a core component which transforms the input electric energy to output mechanical energy in ultrasonic transducer. So the excitation modes of PZT element have an important influence on the characteristics of transducer. The force factor formulas of cylindrical transducers based on the bending vibration mode are deduced in theory and the excitation modes of PZT elements in bending cylindrical transducers were investigated. In detail, the influence of distributing positions and dimensions of PZT plates on the output performance of transducer were discussed and simulated by FEM. It indicated that disposing the PZT plates on the peak of strain curve for the bending vibration mode is the optimal method to excite the transducer. The total length of PZT element should not exceed the distance of two vibration nodes. For the bending cylindrical transducer bonded with PZT plates, increasing the thickness of each PZT plate is propitious to enhance the output characteristics of this type transducer. Whereas, the thickness of each PZT plate should be decreased to achieve an excellent performance for the transducer with a sandwich structure.
Keywords :
finite element analysis; lead compounds; oxygen compounds; piezoelectric transducers; ultrasonic transducers; vibrations; zirconium compounds; FEM; PZT; bending cylindrical transducers; bending vibration mode; distributing positions; excitation modes; input electric energy; optimal method; output mechanical energy; plates dimensions; sandwich structure; strain curve; ultrasonic transducer; Acoustics; Bonding; Force; Metals; Transducers; Ultrasonic transducers; Vibrations; Bending vibration; Cylindrical ultrasonic transducer; Excitation mode; Force factor; PZT element;
Conference_Titel :
Piezoelectricity, Acoustic Waves and Device Applications (SPAWDA), 2011 Symposium on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-1075-8
DOI :
10.1109/SPAWDA.2011.6167250