DocumentCode
3524657
Title
Study on a new contact material-Ag/SnO2-La2O 3-Bi2O3
Author
Wang, Jingqin ; Wen, Ming ; Wang, Baozhu ; Lu, Jianguo
Author_Institution
Hebei Univ. of Technol., Tianjin, China
fYear
2001
fDate
2001
Firstpage
94
Lastpage
97
Abstract
For this paper, a super-fine compound powder, Ag/SnO2+La2O3+Bi2O3 has been obtained successfully using the chemical coprecipitation method, and a new contact material, Ag/SnO2+La2O 3+Bi2O3, was produced by the powder metallurgy method. Its properties are as follows: density is 9.75~9.93 g/cm3, resistivity is 2.31~2.551 Ωcm, and hardness is 880~985 MPa. Its microstructure shows that the fine oxides have a uniform distribution in the silver matrix. The results of make-break capacity and temperature rise testing show that the new material has better anti-arc erosion ability and lower temperature rise than that of commonly used Ag/CdO material
Keywords
arcs (electric); bismuth compounds; density; electrical contacts; electronic equipment testing; hardness; lanthanum compounds; powder metallurgy; precipitation (physical chemistry); silver; tin compounds; wear resistance; 2.31 to 2.55 muohmcm; Ag-SnO2-La2O3-Bi2O 3; Ag/CdO material; Ag/SnO2+La2O3+Bi2O 3 contact material; Ag/SnO2+La2O3+Bi2O 3 superfine compound powder; Ag/SnO2-La2O3-Bi2O 3 contact material; anti-arc erosion ability; chemical coprecipitation method; contact material; density; fine oxide distribution; hardness; make-break capacity testing; microstructure; powder metallurgy method; resistivity; silver matrix; temperature rise; temperature rise testing; Additives; Chemical technology; Composite materials; Conductivity; Contact resistance; Inorganic materials; Microstructure; Powders; Silver; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts, 2001. Proceedings of the Forty-Seventh IEEE Holm Conference on
Conference_Location
Montreal, Que.
Print_ISBN
0-7803-6667-0
Type
conf
DOI
10.1109/HOLM.2001.953195
Filename
953195
Link To Document