Title :
Chemical analysis of outdoor silicone materials after electrical and environmental testing
Author :
Krivda, A. ; Greuter, F. ; Rocks, J. ; Kornmann, X. ; Meier, P.
Author_Institution :
Corporate Res., ABB Switzerland, Baden
Abstract :
In this work the results of electrical and environmental testing of outdoor silicone rubber insulating materials are presented. Degradation paths in silicone insulation were occasionally observed in the artificially accelerated and field tests. Chemical analysis of material in the degradation path has shown that the original material had transformed into the orthorhombic mullite Al6Si2O13. The formation of mullite in the degradation paths indicates that local surface temperatures during discharge activity on the surface may well be over 1200degC degrees. Alumina trihydrate (ATH) filler was observed to be homogeneously distributed in the studied material. The filler had platelet-like form and was hexagonal in shape. The filler particles were several micrometers in size with submicrometer thickness. In addition to the ATH filler, occasional impurities such as NaCl and KCl salt crystals were observed in the bulk material. Soxhlet extraction has shown that tested high temperature vulcanised rubbers (HTV) contained about 2%w of low molecular weight (LMW) silicone species while liquid silicone rubber (LSR) contained about 4%w of LMW silicone.
Keywords :
aluminium compounds; chemical analysis; environmental degradation; environmental testing; filled polymers; impurities; potassium compounds; silicone rubber insulators; sodium compounds; surface discharges; Al6Si2O13; KCl; NaCl; Soxhlet extraction; alumina trihydrate; chemical analysis; electrical testing; environmental testing; orthorhombic mullite phase; silicone rubber insulating materials; surface discharge; surface temperature; vulcanised rubbers; Chemical analysis; Crystalline materials; Degradation; Dielectrics and electrical insulation; Insulation testing; Life estimation; Materials testing; Rubber; Surface discharges; Temperature;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2006 IEEE Conference on
Conference_Location :
Kansas City, MO
Print_ISBN :
1-4244-0546-7
Electronic_ISBN :
1-4244-0547-5
DOI :
10.1109/CEIDP.2006.311951