DocumentCode
3525620
Title
Dielectric spectroscopy in Silicone Rubber Incorporating Nanofillers
Author
Pérez, N. Andrés ; Sylvestre, A. ; Augé, J.L. ; Do, M.T. ; Rowe, S.
Author_Institution
Electrostatic & Dielectr. Mater. Lab. LEMD, CNRS, Grenoble
fYear
2006
fDate
15-18 Oct. 2006
Firstpage
453
Lastpage
456
Abstract
Dielectric isothermal spectroscopy is performed on micro composite and micro/nano composite silicone rubber in the ranges of temperature and frequency of [113-293 K] and [10-1-106 Hz] respectively. Two specimen have been studied: i) a commercial liquid silicone rubber LSR containing `micro-sized\´ fumed silica fillers; ii) the same silicone rubber in which we added 0.10 weight fraction of nano SiOx particles. A comparison of their dielectric responses (real epsiv\´ and imaginary epsiv" parts of dielectric permittivity) is presented. For the commercial LSR without nano SiOx, typical values of epsiv\´ and epsiv" have been obtained. As plotted against the temperature (at a fixed frequency) epsiv\´ and epsiv" present a maximum around 155 K which is attributed to the a relaxation around the glass transition. A strong relaxation peak is observed as nano particles are added in the commercial silicone rubber. The more probable phenomenon to explain this peak is the adsorption of water at the filler surface before mixing.
Keywords
nanocomposites; permittivity; silicone rubber; silicone rubber insulators; 10-1 to 106 Hz; 113 to 293 K; SiOx; dielectric isothermal spectroscopy; dielectric permittivity; filler surface; glass transition; liquid silicone rubber; micro-sized fumed silica fillers; microcomposite silicone rubber; nano SiOx particles; nanocomposite silicone rubber; silicone rubber incorporating nanofillers; Dielectric materials; Dielectric measurements; Electrochemical impedance spectroscopy; Frequency; Nanoparticles; Permittivity; Polymers; Rubber; Silicon compounds; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2006 IEEE Conference on
Conference_Location
Kansas City, MO
Print_ISBN
1-4244-0547-5
Electronic_ISBN
1-4244-0547-5
Type
conf
DOI
10.1109/CEIDP.2006.311967
Filename
4105468
Link To Document