• DocumentCode
    3526319
  • Title

    Formation of low energy electron beam with silicon field emitter arrays for space charge compensation in low-energy ion-implantation system

  • Author

    Taguchi, Shuhei ; Takeuchi, Mitsuaki ; Gotoh, Yasuhito ; Tsuji, Hiroshi ; Ishikawa, Junzo ; Sakai, Shigeki

  • Author_Institution
    Dept. of Electron. Sci. & Eng., Kyoto Univ. Kyotodaigaku-Katsura, Kyoto, Japan
  • fYear
    2009
  • fDate
    20-24 July 2009
  • Firstpage
    201
  • Lastpage
    202
  • Abstract
    The authors have proposed space charge compensation of a low energy ion beam with silicon field emitter arrays to solve the problem of divergence of low energy ion beam for next generation of ion-implantation system. It is required for the electron sources that they do not contain metal to prevent a wafer from contamination. Therefore, as electron sources, a silicon field emitter arrays treated with trifluoromethane plasma (Si:C-FEA) was adopted. It is required to decelerate the electrons to improve the performance of space charge compensation with Si:C-FEA. However, the electron beam extracted from a Si:C-FEA diverges, and it causes decrease in the current of the electrons during the process of deceleration. In this study, the authors have developed the deceleration electrode system to produce low energy electrons efficiently. Space charge compensation of low energy ion beam was performed to confirm its performance.
  • Keywords
    electron field emission; electron optics; electron sources; ion implantation; Si:C; deceleration electrode system; low energy electron beam formation; low energy ion implantation system; silicon field emitter array; space charge compensation; Apertures; Electrodes; Electron beams; Electron sources; Field emitter arrays; Ion beams; Lenses; Silicon; Space charge; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference, 2009. IVNC 2009. 22nd International
  • Conference_Location
    Shizuoka
  • Print_ISBN
    978-1-4244-3587-6
  • Electronic_ISBN
    978-1-4244-3588-3
  • Type

    conf

  • DOI
    10.1109/IVNC.2009.5271586
  • Filename
    5271586