DocumentCode
3526582
Title
Nanometer-order base length, sharp and uniform field emitter arrays fabricated by transfer mold method
Author
Nakamoto, Masayuki ; Moon, Jonghyun ; Shiratori, Koji ; Sugiyama, Yasushi
Author_Institution
Res. Inst. of Electron., Shizuoka Univ., Hamamatsu, Japan
fYear
2009
fDate
20-24 July 2009
Firstpage
167
Lastpage
177
Abstract
In this paper nanometer-order base length, sharp and uniform field emitter arrays with 64 nm base length and 2.5 nm tip radius, which is the smallest and sharpest FEAs ever reported, have been developed by transfer mold method to realize the uniform and stable field emission characteristics. The reverse-pyramidal shape mold with thin SiO2 layer for sharpness was fabricated by using e-beam lithography. It was formed on Si substrates by anisotropic etching, on which emitter materials Ni thin-film are deposited using ultrafine electroplating method. The emitter film was bonded to another substrate, and then the Si-mold substrate was removed entirely. Resultantly, the sharpened emitter array could be obtained reproducibly and uniformly.Thus nanostructure Ni-FEAs have been developed using by transfer mold method with high uniformity and reliability. The nanostructure transfer mold FEAs with 64-nm-base length can be useful for field emission device and vacuum nanodevice.
Keywords
electron beam lithography; electroplating; etching; field emitter arrays; nanoelectronics; nickel; thin films; FEAs; Ni; anisotropic etching; e-beam lithography; field emission device; field emitter arrays fabrication; reverse-pyramidal shape mold; size 2.5 nm; size 64 nm; stable field emission characteristics; thin-film deposition; transfer mold method; ultrafine electroplating method; vacuum nanodevice; Anisotropic magnetoresistance; Etching; Field emitter arrays; Lithography; Nanoscale devices; Nanostructured materials; Semiconductor thin films; Shape; Sputtering; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Nanoelectronics Conference, 2009. IVNC 2009. 22nd International
Conference_Location
Shizuoka
Print_ISBN
978-1-4244-3587-6
Electronic_ISBN
978-1-4244-3588-3
Type
conf
DOI
10.1109/IVNC.2009.5271600
Filename
5271600
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