DocumentCode
3526642
Title
Haptic cues for effective learning in 3D maze navigation
Author
Sepulveda-Cervantes, Gabriel ; Parra-Vega, Vicente ; Dominguez-Ramirez, Omar
Author_Institution
Dept. of Electr. Eng., CINVESTAV, Mexico City
fYear
2008
fDate
18-19 Oct. 2008
Firstpage
93
Lastpage
98
Abstract
Navigation in 3D virtual environment is a popular task in modern 3D applications. The main information is visual, which leads to an incomplete acknowledgement of the virtual environment, since other senses are impaired, such as touch or hearing. Haptic devices provides kinesthetic information which may improve the navigation capabilities of humans in virtual environments, however 3D haptic applications use intensive low level programming languages. This paper presents a 3D maze haptic navigation based on kinesthetic perception of the walls of the maze, wherein the walls surface have different properties, thus a learning haptic process enables better navigation skills after few trials. Experimental results done with a test users group, is realized with Novint as the haptic device and Panda3D as the haptic rendering system. Results with and without haptic cues indicates a successful learning curve to navigate with haptic cues. The haptic cues used are surface texture, viscosity, elasticity, shape recognition and external force. The results highlight the importance of haptic cues as navigation reference to improve the performance of the users.
Keywords
haptic interfaces; rendering (computer graphics); virtual reality; 3D maze navigation; haptic cues; haptic devices; haptic rendering system; kinesthetic information; kinesthetic perception; learning haptic process; programming languages; virtual environment; Auditory system; Computer languages; Elasticity; Haptic interfaces; Humans; Navigation; Surface texture; System testing; Virtual environment; Viscosity; 3D applications; Haptic applications; virtual navigation;
fLanguage
English
Publisher
ieee
Conference_Titel
Haptic Audio visual Environments and Games, 2008. HAVE 2008. IEEE International Workshop on
Conference_Location
Ottawa, Ont.
Print_ISBN
978-1-4244-2668-3
Electronic_ISBN
978-1-4244-2669-0
Type
conf
DOI
10.1109/HAVE.2008.4685305
Filename
4685305
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