A differential photoreceiver hybrid integrating a dual-PD and a high-speed GaAs amplifier IC on a planar lightwave circuit platform

Author

Ohyama, Takaharu ; Yamada, Takashi ; Akahori, Yuji ; Oguma, Manabu ; Sugita, Akio ; Kato, Kazutoshi

Author_Institution

NTT Photonics Labs., Ibaraki, Japan

Volume

2

fYear

1999

fDate

18-22 Oct. 1999

Firstpage

1671

Abstract

We have fabricated a hybrid integrated differential photoreceiver by assembling a dual-PD and a high-speed GaAs amplifier IC using a novel flip-chip bonding technique on a planar lightwave circuit (PLC) platform that has integrated MIM condensers. The photoreceiver had a very wide bandwidth wide enough to receive a 12-Gbit/s Manchester-encoded optical signal.

Keywords

III-V semiconductors; MESFET integrated circuits; amplifiers; flip-chip devices; gallium arsenide; integrated optics; optical receivers; photodiodes; 12 Gbit/s; GaAs; Manchester-encoded optical signal; bandwidth; differential photoreceiver hybrid; dual-PD; flip-chip bonding technique; high-speed GaAs amplifier IC; hybrid integrated differential photoreceiver; integrated MIM condensers; planar lightwave circuit; planar lightwave circuit platform; Assembly; Bandwidth; Bonding; Differential amplifiers; Gallium arsenide; High speed integrated circuits; High speed optical techniques; Hybrid integrated circuits; Optical amplifiers; Programmable control;

fLanguage

English

Publisher

ieee

Conference_Titel

Communications, 1999. APCC/OECC '99. Fifth Asia-Pacific Conference on ... and Fourth Optoelectronics and Communications Conference

Conference_Location

Beijing, China

Print_ISBN

7-5635-0402-8

Type

conf

DOI

10.1109/APCC.1999.820622

Filename

820622