DocumentCode
3526855
Title
High reliability hybrid planar lightwave circuit module integrated with a preamplifier using a plastic package for optical access networks
Author
Kudo, Miyuki ; Terashima, Tokihiro ; Nakamura, Tsutomu
Author_Institution
Oki Electr. Ind. Co. Ltd., Tokyo, Japan
Volume
2
fYear
1999
fDate
18-22 Oct. 1999
Firstpage
1687
Abstract
We have developed a low cost and hybrid integrated planar lightwave circuit module with passive alignment technology for fiber to the home systems. We succeeded in the development of the high reliability plastic package type module.
Keywords
hybrid integrated circuits; integrated circuit packaging; integrated circuit reliability; modules; optical fibre subscriber loops; plastics; preamplifiers; FTTH; fiber to the home systems; high reliability module; high reliability plastic package; hybrid integrated circuit module; hybrid planar lightwave circuit module; optical access networks; passive alignment technology; plastic package; preamplifier; Costs; Integrated circuit reliability; Metalworking machines; Optical filters; Optical network units; Optical receivers; Packaging; Plastics; Programmable control; Programmable logic arrays;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications, 1999. APCC/OECC '99. Fifth Asia-Pacific Conference on ... and Fourth Optoelectronics and Communications Conference
Conference_Location
Beijing, China
Print_ISBN
7-5635-0402-8
Type
conf
DOI
10.1109/APCC.1999.820627
Filename
820627
Link To Document