DocumentCode
3527029
Title
A 3D integrated design for a compact THz wave generator
Author
Lin, Ming-Chieh
Author_Institution
Dept. of Phys., Fu Jen Catholic Univ., Taipei, Taiwan
fYear
2009
fDate
20-24 July 2009
Firstpage
79
Lastpage
80
Abstract
A field emission based THz device suitable for MEMS fabrication had been proposed at IVNC 2004. The interactions between the electrons and the terahertz waves in a vacuum electronic device based on field emission had been studied employing a 2D finite-difference time-domain particle-in-cell simulation. The simulation results showed that the efficiency of the design corresponding to a trimmed cathode is up to about 4% without employing any magnetic circuit. These exciting results were based on the 2D design, analysis and simulations. However, the real circuit of this design has to be realized in a vacuum chamber or a laboratory. Due to the wide need of compact THz sources, we have carried out a 3D integrated design of this THz wave generator suitable for both a MEMS fabrication and a vacuum seal. In this presentation, we will introduce this compact THz wave generator. Detail designs including trimmed field emission cathodes, high voltage insulations, input and output structures, and possible fabrication processes to realize this device will be presented.
Keywords
finite difference time-domain analysis; integrated circuit design; microfabrication; micromechanical devices; terahertz wave generation; 2D finite-difference time-domain simulation; 3D integrated design; MEMS fabrication; THz wave generator; electron-terahertz wave interaction; magnetic circuit; vacuum electronic device; Analytical models; Cathodes; Circuit simulation; Electron emission; Fabrication; Finite difference methods; Magnetic analysis; Magnetic circuits; Micromechanical devices; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Nanoelectronics Conference, 2009. IVNC 2009. 22nd International
Conference_Location
Shizuoka
Print_ISBN
978-1-4244-3587-6
Electronic_ISBN
978-1-4244-3588-3
Type
conf
DOI
10.1109/IVNC.2009.5271622
Filename
5271622
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