• DocumentCode
    3527029
  • Title

    A 3D integrated design for a compact THz wave generator

  • Author

    Lin, Ming-Chieh

  • Author_Institution
    Dept. of Phys., Fu Jen Catholic Univ., Taipei, Taiwan
  • fYear
    2009
  • fDate
    20-24 July 2009
  • Firstpage
    79
  • Lastpage
    80
  • Abstract
    A field emission based THz device suitable for MEMS fabrication had been proposed at IVNC 2004. The interactions between the electrons and the terahertz waves in a vacuum electronic device based on field emission had been studied employing a 2D finite-difference time-domain particle-in-cell simulation. The simulation results showed that the efficiency of the design corresponding to a trimmed cathode is up to about 4% without employing any magnetic circuit. These exciting results were based on the 2D design, analysis and simulations. However, the real circuit of this design has to be realized in a vacuum chamber or a laboratory. Due to the wide need of compact THz sources, we have carried out a 3D integrated design of this THz wave generator suitable for both a MEMS fabrication and a vacuum seal. In this presentation, we will introduce this compact THz wave generator. Detail designs including trimmed field emission cathodes, high voltage insulations, input and output structures, and possible fabrication processes to realize this device will be presented.
  • Keywords
    finite difference time-domain analysis; integrated circuit design; microfabrication; micromechanical devices; terahertz wave generation; 2D finite-difference time-domain simulation; 3D integrated design; MEMS fabrication; THz wave generator; electron-terahertz wave interaction; magnetic circuit; vacuum electronic device; Analytical models; Cathodes; Circuit simulation; Electron emission; Fabrication; Finite difference methods; Magnetic analysis; Magnetic circuits; Micromechanical devices; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference, 2009. IVNC 2009. 22nd International
  • Conference_Location
    Shizuoka
  • Print_ISBN
    978-1-4244-3587-6
  • Electronic_ISBN
    978-1-4244-3588-3
  • Type

    conf

  • DOI
    10.1109/IVNC.2009.5271622
  • Filename
    5271622