• DocumentCode
    3527143
  • Title

    Cost and availability analysis of 2- and 3-connected WDM networks physical interconnection

  • Author

    Gutierrez, Jose M. ; Riaz, Tahir ; Pedersen, Jens M.

  • Author_Institution
    Dept. of Electron. Syst., Aalborg Univ., Aalborg, Denmark
  • fYear
    2012
  • fDate
    Jan. 30 2012-Feb. 2 2012
  • Firstpage
    242
  • Lastpage
    246
  • Abstract
    Our future in personal and professional lives is becoming more attached to the evolution of communication technologies and their applications. Consequently, the way Next Generation Network are currently being planned and deployed, might have a great impact on common people depending on how networks are physically interconnected. Ideally networks should be cheap, reliable, flexible, and energy efficient, among other properties. However, some of these properties are contradictory, i.e. higher fault tolerant networks usually imply higher deployment costs. Therefore, the interconnection decision is a search for the best trade-off among the relevant parameters for the network. In this paper we analyze this trade-off by studying 2-and 3-connected graphs to be used as WDM (Wavelength Division Multiplexing) networks physical infrastructure. The experiments show how the way links are distributed to interconnect the nodes has a significant impact on the cost and availability of the network.
  • Keywords
    fault tolerance; graph theory; next generation networks; telecommunication network planning; telecommunication network reliability; wavelength division multiplexing; WDM network physical interconnection; fault tolerant networks; network availability analysis; next generation network planning; three-connected graphs; wavelength division multiplexing; Availability; Europe; Network topology; Optical fiber networks; Routing; Topology; WDM networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computing, Networking and Communications (ICNC), 2012 International Conference on
  • Conference_Location
    Maui, HI
  • Print_ISBN
    978-1-4673-0008-7
  • Electronic_ISBN
    978-1-4673-0723-9
  • Type

    conf

  • DOI
    10.1109/ICCNC.2012.6167420
  • Filename
    6167420