• DocumentCode
    3527259
  • Title

    Enhancement of ion-induced bending (IIB) phenomenon using a double-layered film for FEA fabrication

  • Author

    Yoshida, T. ; Nagao, M. ; Kanemaru, S.

  • Author_Institution
    Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
  • fYear
    2009
  • fDate
    20-24 July 2009
  • Firstpage
    35
  • Lastpage
    36
  • Abstract
    We have proposed a simple bending technique for fabricating field emitter arrays (FEAs), based on the ion-induced bending (IIB) effect. In previous studies, we found that the bending angle could be controlled by adjusting the depth of ion irradiation, irrespective of the ion-species, IIB could be applied to various materials deposited by a non-specialized sputtering system. Using this technique, we developed a fabrication process for a molybdenum vertical-thin-film (VTF) field emitter array. The IIB technique is a simple bending technique for FEAs because it provides greater freedom of choice in materials, does not require any specialized equipment, and matches conventional microfabrication processes. It was found that the IIB effect could be enhanced by using a double-layered film method. The required dose could consequently be decreased to less than 5x1015 cm-2 in the case of using a heavy element for the cantilever film. This method increases the potential of IIB as a simple fabrication technique for FEA device structures.
  • Keywords
    bending; field emitter arrays; ion beam effects; microfabrication; molybdenum; sputtering; FEA fabrication; Mo; double layered film; field emitter arrays; ion irradiation; ion-induced bending; microfabrication; sputtering system; vertical-thin-film; Atomic measurements; Control systems; Electronic mail; Fabrication; Field emitter arrays; Industrial control; Sputtering; Textile industry; Tungsten; Weight control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference, 2009. IVNC 2009. 22nd International
  • Conference_Location
    Shizuoka
  • Print_ISBN
    978-1-4244-3587-6
  • Electronic_ISBN
    978-1-4244-3588-3
  • Type

    conf

  • DOI
    10.1109/IVNC.2009.5271634
  • Filename
    5271634