DocumentCode
3527469
Title
Periodic thermal management for hard real-time systems
Author
Long Cheng ; Kai Huang ; Gang Chen ; Biao Hu ; Knoll, Alois
Author_Institution
Robot. & Embedded Syst., Tech. Univ. Muenchen, Munich, Germany
fYear
2015
fDate
8-10 June 2015
Firstpage
1
Lastpage
10
Abstract
Due to growing power density, on-chip temperature increases rapidly, which has hampered the reliability and performance of modern real-time systems. This paper studies how to minimize the peak temperature for hard real-time systems under hard real-time constraints with periodic thermal management. A closed-form representation of the peak temperature for such a periodic scheme is derived to tackle this problem. Based on this closed-form and the arrival curve model which is used to model the system workload, two approaches that can derive periodic thermal management are proposed to minimize the peak temperature for a given event stream with a trade-off between complexity and accuracy. Case studies show that our approaches can achieve similar or better level of peak temperature but with two or three orders of magnitude lower computation expense compared to previous work.
Keywords
microprocessor chips; real-time systems; reliability; temperature; arrival curve model; closed-form representation; hard real-time systems; on-chip temperature; periodic thermal management; power density; reliability; Decision support systems; Optical wavelength conversion; Rail to rail outputs; Three-dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Embedded Systems (SIES), 2015 10th IEEE International Symposium on
Conference_Location
Siegen
Type
conf
DOI
10.1109/SIES.2015.7185040
Filename
7185040
Link To Document