• DocumentCode
    3527469
  • Title

    Periodic thermal management for hard real-time systems

  • Author

    Long Cheng ; Kai Huang ; Gang Chen ; Biao Hu ; Knoll, Alois

  • Author_Institution
    Robot. & Embedded Syst., Tech. Univ. Muenchen, Munich, Germany
  • fYear
    2015
  • fDate
    8-10 June 2015
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Due to growing power density, on-chip temperature increases rapidly, which has hampered the reliability and performance of modern real-time systems. This paper studies how to minimize the peak temperature for hard real-time systems under hard real-time constraints with periodic thermal management. A closed-form representation of the peak temperature for such a periodic scheme is derived to tackle this problem. Based on this closed-form and the arrival curve model which is used to model the system workload, two approaches that can derive periodic thermal management are proposed to minimize the peak temperature for a given event stream with a trade-off between complexity and accuracy. Case studies show that our approaches can achieve similar or better level of peak temperature but with two or three orders of magnitude lower computation expense compared to previous work.
  • Keywords
    microprocessor chips; real-time systems; reliability; temperature; arrival curve model; closed-form representation; hard real-time systems; on-chip temperature; periodic thermal management; power density; reliability; Decision support systems; Optical wavelength conversion; Rail to rail outputs; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Embedded Systems (SIES), 2015 10th IEEE International Symposium on
  • Conference_Location
    Siegen
  • Type

    conf

  • DOI
    10.1109/SIES.2015.7185040
  • Filename
    7185040