Technology frontiers towards the 21st century: embedded DRAM and the system LSIs-process, circuits, and design technology

Author

Takeda, Eiji ; Wantanabe, T. ; Kimura, Shinichiro ; Suzuki, Kei ; Sasaki, Katsuro

Author_Institution

Central Res. Labs., Hitachi Ltd., Tokyo, Japan

fYear

1999

fDate

1999

Firstpage

11

Lastpage

21

Abstract

The development of silicon technology is opening the new era of “systems on silicon”. That is, a large-scale memory will be integrated with a CPU and other logic macros. These kinds of chips, so-called system LSIs, have a promising future, especially in mobile systems for advanced multimedia applications since they feature high data-transfer rate, low I/O power dissipation, and system miniaturization. However, such a system-oriented LSI causes new technical problems such as increases in subthreshold leakage current, process cost, and design complexity. It will also have a significant influence on the business strategies of LSI makers. This paper reviews the features and issues of embedded DRAMs and system LSIs and then introduces advanced technologies for designing and fabricating them

Keywords

DRAM chips; embedded systems; large scale integration; technological forecasting; embedded DRAM; future developments; silicon technology; system LSI; systems on silicon; Books; Circuits; EPROM; Hot carrier effects; Large scale integration; Lithography; Physics; Process design; Random access memory; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI and CAD, 1999. ICVC '99. 6th International Conference on

Conference_Location

Seoul

Print_ISBN

0-7803-5727-2

Type

conf

DOI

10.1109/ICVC.1999.820805

Filename

820805