Title :
Thematic network “Adhesives in Electronics”. A two year review and future plans
Author_Institution :
VDI/VDE-Technologiezentrum Informationstechnik GmbH, Teltow, Germany
Abstract :
In order to overcome the problems of the use of adhesives in electronics manufacturing, a so called “Thematic Network” on “Adhesive Joining Technology in Electronics Manufacturing (Adhesives in Electronics)” was launched March 1998. Within this project, which is funded by the European Community, 52 partners throughout Europe cooperate in order to exchange relevant information and to coordinate future fields for research and development
Keywords :
adhesives; electronic equipment manufacture; research and development management; reviews; European Community; adhesives; electronics manufacturing; research and development; review; thematic network; Cost function; Databases; Electronics industry; Electronics packaging; Europe; Intelligent networks; Manufacturing; Production systems; Project management; Research and development;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Conference_Location :
Espoo
Print_ISBN :
0-7803-6460-0
DOI :
10.1109/ADHES.2000.860625
