DocumentCode :
3529076
Title :
A novel vehicle assignment method for automated material handling system in semiconductor manufacturing
Author :
Lin, James T. ; Huang, Chih-Wei
Author_Institution :
Dept. of Ind. Eng. & Eng. Manage., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
Volume :
Part 3
fYear :
2011
fDate :
3-5 Sept. 2011
Firstpage :
1627
Lastpage :
1631
Abstract :
In semiconductor manufacturing, a diffusion tool is characterized by its long-processing time of 6 to 12 hours with the process flow being highly re-entrant, thus making it a form-batch operation. With the use of form-batch, wafer lots are temporarily stored in the stocker and are delivered to diffusion tools when the Work-In-Process (WIP) pool reaches 4 to 6 lots. As a result, diffusion tools wait for long wafer delivery time due to the low-efficiency AMHS vehicle assignment method, thus greatly impacting transportation and production efficiency. A novel vehicle assignment method is proposed to improve wafer lots´ transport time. Unlike the existing vehicle assignment method, which sequentially assigns empty vehicle to a load port, our proposed method calls several empty vehicles to move to a load port to simultaneously execute transport jobs with the goal of shortening a vehicle´s arrival time. To aid in our research, we performed simulation analysis of an AMHS for a diffusion area. The simulation outcome indicated that a substantial improvement in AMHS transport performance was achieved with implementation of the novel vehicle assignment method.
Keywords :
materials handling; semiconductor device manufacture; work in progress; WIP pool; automated material handling system; diffusion tool; semiconductor manufacturing; vehicle assignment method; work-in-process; Dispatching; Furnaces; Load modeling; Object oriented modeling; Semiconductor device modeling; Simulation; Vehicles; AMHS; simulation; vehicle assignment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Engineering and Engineering Management (IE&EM), 2011 IEEE 18Th International Conference on
Conference_Location :
Changchun
Print_ISBN :
978-1-61284-446-6
Type :
conf
DOI :
10.1109/ICIEEM.2011.6035471
Filename :
6035471
Link To Document :
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