DocumentCode :
35291
Title :
Heat Capacity, Thermal Conductivity, and Interface Resistance Extraction for Single-Walled Carbon Nanotube Films Using Frequency-Domain Thermoreflectance
Author :
Yuan Gao ; Marconnet, Amy M. ; Rong Xiang ; Maruyama, Shoichi ; Goodson, Kenneth E.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
Volume :
3
Issue :
9
fYear :
2013
fDate :
Sept. 2013
Firstpage :
1524
Lastpage :
1532
Abstract :
Thermal interface materials (TIMs) based on vertically aligned carbon nanotube (VACNT) films promise the unusual combination of high thermal conductance and low elastic modulus, properties that are critical for TIM performance and reliability. This paper reports through-plane thermal conductivity, heat capacity, and boundary resistances measured using frequency domain thermoreflectance for seven VACNT films. The films are composed of single-walled carbon nanotubes grown using chemical vapor deposition on Si substrates and have thicknesses from 5.3 to 81 μm. The top surfaces of the films are coated with 100-nm Ti and 100-nm Ag as a transducer layer for the thermoreflectance measurement. The roughness of the top surface of each sample is measured using atomic force microscopy. The average thermal conductivity of the films ranges from 2.1 to 3.5 W m-1 K-1 and the average heat capacity ranges from 5.5 to 9.3 J cm-3 K-1. The heat capacity of the films is used to calculate the volume fraction of tubes that contributes to thermal conduction. The CNT-metal boundary resistances are below 1 m2 K MW-1 and the CNT-substrate resistance ranges from 3 to 80 m2 K MW-1. Variations of the nanotube alignment and morphology throughout the film are also examined using scanning electron micrographs to provide a comprehensive analysis of these films.
Keywords :
carbon nanotubes; chemical vapour deposition; coatings; elastic moduli; nanofabrication; scanning electron microscopy; specific heat; surface roughness; thermal conductivity; thermoreflectance; thin films; C; CNT-metal boundary resistances; CNT-substrate resistance; Si; Si substrates; TIM performance; VACNT films; atomic force microscopy; boundary resistances; chemical vapor deposition; coated films; elastic modulus; frequency domain thermoreflectance; frequency-domain thermoreflectance; heat capacity; interface resistance extraction; nanotube alignment; nanotube morphology; scanning electron micrographs; single-walled carbon nanotube films; single-walled carbon nanotube growth; size 100 nm; size 5.3 mum to 81 mum; thermal conductance; thermal conductivity; thermal interface materials; thermoreflectance measurement; through-plane thermal conductivity; top surface roughness; transducer layer; vertically aligned carbon nanotube films; Carbon nanotubes (CNTs); nanotechnology; thermal management; thermoreflectance; thin films;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2254175
Filename :
6507649
Link To Document :
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