Title :
Fabrication of FePt/FeCo/FePt exchange spring trilayers with very thin FeCo layer for high resolution MFM tips
Author :
Rheem, Y.W. ; Saito, H. ; Ishio, Shunji
Author_Institution :
Venture Bus. Lab., Akita Univ., Japan
Abstract :
In this work, a diffusion barrier layer is introduced for fabricating FePt/FeCo/FePt exchange-spring films with very thin soft layer. The hard magnetic properties of the films are investigated. The FePt/C/Ta/FeCo/Ta/C/FePt multilayer films are deposited on oxidized Si substrates using RF magnetron sputtering method and are annealed at 873, 923, and 973 K using rapid thermal annealing to produce the FePt L10 ordered hard layer. The Ta/C layers, with thickness x nm, are introduced for intermediate layers between soft and hard magnetic layers to prevent interface alloying during annealing. Results show that annealing gives hard magnetic properties to the films due to the ordering of FePt. The film with x=0 shows one-stage magnetic reversal and the Hc is about 3 kOe. The sharp peak of reversible magnetization indicates the evidence of exchange coupled soft layer with hard layer. Increasing the reversible magnetization at Hc increases the soft layer volume. Results from Auger electron spectroscopy indicate that the thin FeCo soft magnetic layer remained although the sample is annealed at high temperature. This suggest TaC particles are formed at the interface and behave as good diffusion barriers without degradation of exchange-spring magnetic property.
Keywords :
Auger electron spectra; cobalt alloys; diffusion barriers; exchange interactions (electron); ferromagnetic materials; iron alloys; magnetic force microscopy; magnetic multilayers; magnetisation reversal; permanent magnets; platinum alloys; rapid thermal annealing; soft magnetic materials; sputter deposition; sputtered coatings; tantalum compounds; 873 K; 923 K; 973 K; Auger electron spectroscopy; FePt-FeCo-FePt; L10 ordered hard layer; RF magnetron sputtering; diffusion barrier layer; exchange coupling; exchange-spring films; interface alloying; magnetic reversal; multilayer films; rapid thermal annealing; soft layer volume; Fabrication; Magnetic films; Magnetic force microscopy; Magnetic multilayers; Magnetic properties; Magnetization; Rapid thermal annealing; Semiconductor films; Soft magnetic materials; Springs;
Conference_Titel :
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN :
0-7803-9009-1
DOI :
10.1109/INTMAG.2005.1463588