A MEMS custom micropackaging solution

In many complex applications, especially in the biomedical areas, a MEMS sensor, analyzer or actuator cannot be designed independently from the required packaging solution. The design and simulation of a fabrication process for a custom micropackaging solution is presented. The package is based on a generalized modular approach that is suitable for MEMS devices that require permanent or semi-permanent connectivity to another device or system. Components that can be integrated together using the proposed packaging solution could include a MEMS sensor and a System-on-Chip CMOS die implementation. There is no requirement that the technologies be compatible with each other. The modules support a common bus geometry that can provide for complex interconnectivity and input/output requirements.