Title :
Low cost multi-layer ceramic package for flip-chip MMIC up to W-band
Author :
Ito, M. ; Maruhashi, K. ; Ikuina, K. ; Senba, N. ; Takahashi, N. ; Ohata, K.
Author_Institution :
Kansai Electron. Res. Labs., NEC Corp., Shiga, Japan
Abstract :
We have developed a low cost multi-layer low temperature co-fired ceramic (LTCC) package based on a mass production design rule for an MMIC up to W-band. The package structure includes a cavity for the flip-chip MMIC and coplanar feed-throughs improved to suppress radiation. Good small-signal characteristics of a 76 GHz-band amplifier mounted on the package are demonstrated.
Keywords :
MIMIC; ceramic packaging; flip-chip devices; integrated circuit packaging; wiring; 76 GHz; W-band; coplanar feed-throughs; flip-chip MMIC; low temperature co-fired ceramic; mass production design rule; multi-layer ceramic package; package structure; small-signal characteristics; Ceramics; Coplanar waveguides; Costs; Dielectric constant; Dispersion; Electronics packaging; Frequency; Laboratories; MMICs; National electric code;
Conference_Titel :
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5687-X
DOI :
10.1109/MWSYM.2000.860884
