Title :
Optimized flip-chip interconnect for 38 GHz thin-film microstrip multichip modules
Author :
Ngoc-Hoa Huynh ; Heinrich, W. ; Hirche, K. ; Scholz, W. ; Warth, M. ; Ehrlinger, W.
Author_Institution :
Ferdinand-Braun-Inst. fur Hochstfrequenztech., Berlin, Germany
Abstract :
Flip-chip interconnects with 80 /spl mu/m bumps are optimized for 38 GHz by means of electromagnetic simulation. Thin-film microstrip is used as transmission-line on the carrier substrate. A compensation structure reduces reflections at the interconnect below -20 dB. Measurements of a passive structure and active chip modules proved the feasibility of this approach.
Keywords :
MIMIC; circuit optimisation; circuit simulation; compensation; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; microstrip lines; multichip modules; 38 GHz; 80 micron; active chip modules; carrier substrate; compensation structure; electromagnetic simulation; optimized flip-chip interconnect; passive structure; thin-film microstrip multichip modules; Bonding; Capacitance; Coplanar waveguides; Frequency; Integrated circuit interconnections; Microstrip; Multichip modules; Substrates; Transistors; Transmission lines;
Conference_Titel :
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5687-X
DOI :
10.1109/MWSYM.2000.860887
