DocumentCode :
3529940
Title :
From bits to chips: a multidisciplinary curriculum for microelectronics system design education
Author :
Bernstein, Gary H. ; Brockman, Jay B. ; Kogge, Peter M. ; Snider, Gregory L. ; Walvoord, Barbara E.
Author_Institution :
Dept. of Electr. Eng., Notre Dame Univ., IN, USA
fYear :
2003
fDate :
1-2 June 2003
Firstpage :
95
Lastpage :
97
Abstract :
We describe a program in multidisciplinary education of microelectronics systems design at the University of Notre Dame. In the "Bits-to-Chips" course sequence, faculty from the Electrical Engineering and Computer Science and Engineering Departments, and the Kaneb Center for Teaching and Learning have coordinated their related courses and teaching methods, and team-teach a course on advanced technologies and systems-on-a-chip (SOC). Projects in the capstone course have involved the design and fabrication, completely by the students, of CMOS circuits with 10,000 transistors, and are now developing projects with roughly 50,000 devices. A recent project is an accelerometer control chip for insertion into a model rocket launch. Projects are also submitted to MOSIS for comparison with the students\´ efforts.
Keywords :
CMOS integrated circuits; educational courses; electronic engineering education; integrated circuit design; student experiments; system-on-chip; CMOS circuits; Kaneb center; SOC; University of Notre Dame; accelerometer control chip; bits to chips course; capstone course; complementary metaloxide semiconductor; computer science and engineering; electrical engineering; engineering department; learning; microelectronics system design education; multidisciplinary curriculum; multidisciplinary education; rocket launch; system on chip; teaching methods; transistor; Accelerometers; CMOS technology; Circuits; Computer science; Computer science education; Educational programs; Fabrication; Microelectronics; System-on-a-chip; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Systems Education, 2003. Proceedings. 2003 IEEE International Conference on
Print_ISBN :
0-7695-1973-3
Type :
conf
DOI :
10.1109/MSE.2003.1205271
Filename :
1205271
Link To Document :
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