Title :
Application of eddy-current testing technique for high-density double-layer printed circuit board inspection
Author :
Chomsuwan, K. ; Yamada, S. ; Iwahara, M. ; Wakiwaka, H. ; Shoji, S.
Author_Institution :
Inst. of Nature & Environ. Technol., Kanazawa Univ., Japan
Abstract :
Inspection of high-density double-layer printed circuit board (PCB) should examine both layers to obtain an accurate inspection. Eddy-current testing (ECT) technique is successful for defect inspection on single-layer PCB. In this paper, bare high-density double-layer PCB inspection based on ECT technique is studied. Defect points occurred on both top and scanning only over the top layer identifies bottom layers.
Keywords :
eddy current testing; printed circuit testing; printed circuits; defect inspection; defect points; eddy-current testing technique; high-density double-layer printed circuit board; single-layer PCB; Circuit testing; Coils; Conductors; Electrical capacitance tomography; Frequency; Inspection; Magnetic sensors; Printed circuits; Probes; Sensor arrays;
Conference_Titel :
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN :
0-7803-9009-1
DOI :
10.1109/INTMAG.2005.1463639
