• DocumentCode
    3530173
  • Title

    Using System-on-a-Chip as a vehicle for VLSI design education

  • Author

    Laffely, Andrew ; Burleson, Wayne

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Massachusetts Univ. Amherst, MA, USA
  • fYear
    2003
  • fDate
    1-2 June 2003
  • Firstpage
    148
  • Lastpage
    149
  • Abstract
    The increase in complexity of modern microelectronic systems has made it more difficult to find projects for VLSI design courses, which are both manageable and meaningful. Ideally, projects should be more than the implementation of a particular finite state machine. Projects should force students to think about technology and integration issues, while exposing them to cutting-edge architectures. For several years, we have used the Adaptive System-on-a-Chip (aSoC) as a foundation for a combined graduate-undergraduate VLSI design course. This novel SoC architecture provides a unifying theme to the course, while allowing the development of distinct and manageable sub-projects. Students are assigned to small groups, and are responsible for specific subsystems of the larger SoC. As a result, the success of the groups are linked, forcing all students to think about global issues and system integration. This framework also fosters development of student leadership and initiative. It provides a realistic experience using a review-based evaluation system.
  • Keywords
    VLSI; educational courses; electronic engineering education; finite state machines; integrated circuit design; student experiments; system-on-chip; SOC architecture; VLSI design education; adaptive system-on-a-chip; cutting-edge architecture; finite state machine; microelectronic system; review based evaluation system; student leadership; student projects; system integration; very large scale integration; Microelectronics; Vehicles; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Systems Education, 2003. Proceedings. 2003 IEEE International Conference on
  • Print_ISBN
    0-7695-1973-3
  • Type

    conf

  • DOI
    10.1109/MSE.2003.1205293
  • Filename
    1205293