Title :
Infrastructure for education and research of SOC/IP in Taiwan
Author :
Tsai, Wei-Chang ; Huang, Chun-Ming ; Wang, Jiann-Jenn ; Lee, Chen-Yi
Author_Institution :
Nat. Chip Implementation Center, Hsinchu, Taiwan
Abstract :
Due to the trend of SOC/IP, design environments of SOC/IP including the system level simulation, hardware software co-simulation, hardware implementation, hardware software co-verification, and rapid prototyping are needed for education and research. The infrastructure provided by Chip Implementation Center (CIC), founded in 1992 under the National Science Council (NSC) of Taiwan R.O.C., is used to speed up the development and improvement of IC/SOC/IP design environment. Different kinds of EDA tools, training courses, SOC/IP design examples and a system-level rapid prototyping laboratory are provided for education and research. In the future, CIC will continue collaborating with the academia, devoting itself to training more and well qualified researchers and designers, and enhancing the SOC/IP technology level.
Keywords :
design engineering; electronic design automation; electronic engineering education; hardware-software codesign; industrial property; integrated circuit design; rapid prototyping (industrial); research and development; research initiatives; system-on-chip; test facilities; EDA tools; IP; National Science Council; SOC design; SOC education; SOC technology; SOC/IP research; chip implementation center; design engineering; electronic design automation; hardware implementation; hardware software co-simulation; hardware software co-verification; integrated circuit design; intellectual property; prototyping laboratory; rapid prototyping; research initiatives; system level simulation; system on chip; Application software; Consumer electronics; Decoding; Design automation; Electromagnetic interference; Electronic design automation and methodology; Hardware; Prototypes; Software prototyping; Software tools;
Conference_Titel :
Microelectronic Systems Education, 2003. Proceedings. 2003 IEEE International Conference on
Print_ISBN :
0-7695-1973-3
DOI :
10.1109/MSE.2003.1205294
